Triple THT Inspection
The triple AOI system is designed for simultaneous inspection at the return conveyor and from top and bottom before and after wave soldering oven. It has three multi-LED illuminated scanner units as well as our patented lenses which generate parallax free images. The System includes three modus control units. The transport module has a length of 1200mm (47.2 in.).
Triple system for simultaneous inspection of top and bottom before and after the soldering process.
Optional automatic cleaning of the lower inspection area with an air knife.
Combination of different inspection tasks such as SMD placement, THT solder joints, conformal coating and full screening for solder beads (solder balls).
Capture of any number of barcodes and data-matrix codes on the multi PCB.
Full area independent of the number of inspection parts:
25 seconds (including calculation time). Smaller scan area means less inspection time.