Head Start in Quality Assurance
lthough the production of circuit boards has seen a change in the last few years where the conventional Through Hole Technology (THT) is being replaced by the Surface Mount Technology (SMT), in some production situations THT is still necessary. For example, parts that are exposed to high mechanical stress, such as relays, coils, capacitors or connector strips, are still soldered using the selective or wave solder methods. The First-Pass-Yield of these methods is usually lower than that of the reflow method. Typical errors can include open solder joints, solder bridges and solder balls. The high quality standards present in today's market require test and inspection solutions that detect all defects and provide the necessary information for their repair. An optimization of these processes must also be possible. Even if the test object has a large surface area, the tests must be made at production line speed so that a high productivity can be reached and maintained.
he automatic inspection with the modusAOI ensures a rapid and consistent inspection of all soldered components. The combination of the multi-colored and multi-angled LED lighting system and the color scanning unit makes a definite recognition of meniscus and short circuits possible. Recognition of solder balls across the whole test object is possible due to the full-surface acquisition. Unlike a manual inspection, the test results from the modusAOI are objective and reproducible. The inspection also allows a rapid feedback of test results (closed-loop) and the test results can be documented and passed on to repair stations. The result is that time is saved, costs are lowered and there is also a significant raise in quality.
The UnderFloor System from modus can be seamlessly integrated into production lines for the inspection of THT solder joints without the need for a turning station.
The acquisition unit is mounted in a maintenance-free drawer under the production line.
The DoubleInline Systems make the simultaneous inspection of both sides of the test object possible.
The tests are made independently and displayed on two monitors.
The compact and mobile Offline Systems from modus allow an uncomplicated and flexible use of an AOI in numerous positions along the production line.
The ergonomic design with the angled acquisition unit allows the easy integration of the system into a final assembly area.
The DoubleOffline System allows the acquisition of both sides of the test object at once while maintaining the mobility and flexibility of an Offline system.
The two sides can be inspected independent from one another.
Good
Defective
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