Head Start in Quality Assurance

REQUIREMENTS

modusAOI Test Strategy

INSPECTION TECHNIQUES

m

odus is a pioneer in the field of scanner-based automatic optical inspection. A high-resolution CCD scanner makes a high-speed acquisition of the entire surface of the test object possible without the use of a complicated multi-axis system.

The heart of the modusAOI MLD1200 is a color CCD line camera with a resolution of 14,040 x 20,400 pixels per scan (21µm/Pixel). The innovative multi-colored LED lighting system illuminates the test object from multiple angles, which aids greatly in the detection of slanted surfaces, such as solder joints, in the resulting image.

Using the One-Pass scan technology, circuit boards can be tested in three to twenty-five seconds. The mirror and lighting module moves along a single axis while the camera and objective remains stationary, resulting in a closed, maintenance-free system.

TEST METHODS

T

he optical inspection with a modusAOI is based on a predefined test plan. This test plan contains the necessary information to check if the test object meets the specified quality requirements.

The existing test object library can be combined with CAD or Placer data to generate test plans.

The test process starts with the acquisition of one or both sides of the test object. The test field's form and position are then compared with the predefined parameters. The vectoring used by this process makes an accurate test result possible. Using this process, deviations from the given values can easily be found and defects prevented.

Certain test modes have been optimized to provide a more reliable and faster test process for specialized test functions such as solder paste application, component placement, THT or Reflow soldering, full surface recognition of solder balls and inspection of coatings and ceramic.

The test plan's settings and values can be optimized offline with previously-scanned images using a intuitive and user-friendly interface.

In the case of an error, the monitor displays a magnified view of the defective test field along with its relative position on the complete test object and the corresponding test field on the "golden test object" to allow a direct visual comparison.