Read about the latest developments at modus. 
Head Start in Quality Assurance
ne of the most important processes in SMT component production is the solder paste application. Low grade solder application causes almost sixty percent of all defects in finished products. The precision, repeated accuracy and non-fluctuating amount of solder paste during the production of fine-pitch components such as processors and storage devices (QFP, TSOP, etc.) can not be compromised if an error-free production process is to be ensured.
The solder paste is applied with a dispenser or sieve before component placement. This process strongly affects the quality of the end product.
Thick-film methods are used mainly for the production of ceramic circuit boards. If a large number of single printing processes is used then the only way to achieve a high First-Pass-Yield is a one hundred percent inspection of the finished product.
he integration of a modusAOI in the production line after solder paste or glue application makes it possible to monitor the highly important, initial steps of the production process. The system can detect any discrepancies in the amount or position of the paste, paste bridges and smearing of the paste. This allows the early detection of defects before they become expensive errors further into the production process.
The multi-colored and multi-angled LED lighting system guarantees a high contrast between printed and empty pads.
This fully-automatic Inline System can be integrated into production lines to inspect solder paste application. It makes a full inspection of all printed pads possible.
The inspection from above guarantees an error-free inspection of the solder.
The compact and mobile Offline System from modus allows an uncomplicated and flexible use of an AOI in numerous positions along the production line.
The drawer allows the flexible acquisition of various test objects.
PDF data sheet download.
