Read about the latest developments at modus. 
Innovative Quality Control
he production of electronic circuit boards is a complex multi-step process. Numerous factors, including circuit board layout, component placement tolerances, solder storage facilities, the temperature of the solder oven, and over sixty other factors, affect the production process and, subsequently, the end product.
It is common knowledge that more than sixty percent of all production errors stem from solder application. Defective circuit boards due to faulty solder application can be avoided and the solder application process optimized through a thorough inspection of the freshly printed circuit boards.
Glue application with a robotic dispenser or a placement sieve can often result in errors. An inspection directly after the application process can detect missing or smudged glue and the resulting errors are avoided.
After the switch to lead-free solders, the positioning of components became a highly critical process. With an optical inspection directly after the placement of components, expensive repair operations can be avoided.
The final inspection after the soldering process guarantees the proper placement of the correct components. At the same time the solder joints can be inspected and the surface of the circuit board can be checked for short circuits between solder joints or components.
The wave soldering process has one of the highest defect rates in the production of circuit boards. An optical inspection of the surface of the circuit board can detect short circuits, solder balls and missing or balled solder joints.
An inspection of the single steps in the production of thick-film substrates can detect defects immediately and reduce the costs of repair or replacement.
The key to an effective and error-free solder application process is having clean application sieves. This can be attained through an inspection of the sieves between the cleaning process and their use in the production line.
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